Equipments
  • FB-996 BUMP II
  • FB-996 BUMP II

FB-996 BUMP II

DETAILSPARAMETERS

Characteristic

Productivity 12% up compared to our conventional model

4-8wafer handling capability(Manual loading-stud bump area: up to 195mm

Compact transduser, lessen the impact from radiation heatof bonding stage

Various safety measures, Wafer mapping softwaretraceability capability (option)

Eco design with phenomenally low air cosumption

Lowered temperature bonding(Track record: 50 degree C)

Outstanding position repeatability of +3um(3a)

Post-bond-inspection system is available(option

Semi-automatic 8“  wafer Stud Bump Bonder


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