HANHWA
Equipped with a new type lens unit withan expanded field of view and a highpixel CMOS cameraEnlarges the batch recognition areawhile maintaining the detectionresolution
Advanced temperature compensation technology achieves bonding accuracy 30s 2.0um
Brighter and sharply defined image contributes shorter exposure time
Equipped with a USD-1000 ultrasonic generator that improves bondability. Current mode and Voltage mode are newly added tothe conventional control mode. A wide range of support is possible in combination with the ultrasonic profile
By changing design of the machine frame, Workability of operator is improved, and the footprint reduces 87%
KISSSECS/GEM is accommodated as standardCompatible with Kaijo's own host management system Kiss(Kaijo Interconnecting Service System)
