Equipped with a new type lens unit withan expanded field of view and a highpixel CMOS cameraEnlarges the batch recognition areawhile maintaining the detectionresolution

Advanced temperature compensation technology achieves bonding accuracy 30s 2.0um

Brighter and sharply defined image contributes shorter exposure time

Equipped with a USD-1000 ultrasonic generator that improves bondability. Current mode and Voltage mode are newly added tothe conventional control mode. A wide range of support is possible in combination with the ultrasonic profile

By changing design of the machine frame, Workability of operator is improved, and the footprint reduces 87%

KISSSECS/GEM is accommodated as standardCompatible with Kaijo's own host management system Kiss(Kaijo Interconnecting Service System)

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