HANHWA
Han Hwa offers bonding machines are equipped with the cutting edge technologies from Japan Kaijo in the assembly process of the semiconductor manufacturing and LED such as high-speed and fine pitch bonding operation, high-mix low-volume production, stable performance and cost efficient in order to meet more sophisticated and diversified needsHan Hwa offers bonding machines are equipped with the cutting edge technologies from Japan Kaijo in the assembly process of the semiconductor manufacturing and LED such as high-speed and fine pitch bonding operation, high-mix low-volume production, stable performance and cost efficient in order to meet more sophisticated and diversified needs.
FB-988 corresponds to high-end small spacing IC products, FB-996 corresponds to large-scale IC products. We can also customize the equipment for our customers according to their products. In addition, Kaijo’s Wafer Bumper is home to one of the premier wafer bumping and wafer level packaging facilities in the Japan. with 20+ years of experience in developing and providing leading edge interconnect and integration technologies to customers around the world. Han Hwa as an first class agent in China have the unique ability to support early stage development needs as well as low-to-mid volume production for more mature applications. Our FB-996 Bump could handle 6” and 8” wafer sizes with established and proven team experience and the flexibility to tailor unique solutions for your most demanding interconnect requirements.
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Inspection and Handler Systems
Front of Line involves integrated circuit (IC) fabrication where wafer processing operation is being conducted. We offer variety of vision inspection among front of line processes such as plating, die attach, ball attach, wire bond, molding, laser mark, trim and form, saw and singulation, wafer mapping.
Semiconductor front / middle production line
Production front line and IC manufacturing for wafer processing operations. We provide a wide range of visual inspection before its midline process, such as plating, chip bonding, connecting balls, welding, forming, laser marking, trimming and form, saw, monolithic wafer mapping.
Front Line Inspection includes the following processes:
- Trim Form Process
-Laser Mark Process
-Molding Process
-Saw and Singulation Process
-Wafer Mapping Process
-Wire Bond Process
-Ball Attached Process
-Die Attached Process
-Platting Process
End of line processes refer to the test, assembly and packaging of semiconductor products before delivering. We offer vision inspections and measurement at final test process, tester and vision handler in various forms such as tape, tray and reel.
End of semiconductor production lineEnd of line Inspection includes thefollowing processes:
-Mark and Scan Pack Process
-Vision Handler
-Tray to Tray Process
-Reel to Reel / Tap to Reel Process
-Test Handler
Related Products
Post reel to reel vision inspection
QFN wafer vision inspection
Wire bond AOI inspection
