Equipments
  • KAIJO FB-x26
  • KAIJO FB-x26

KAIJO FB-x26

Wide bonding area(Y: 95mm)capable of large IC device production

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DETAILSPARAMETERS

Features of FB-x26 Wide bonding area (Y: 95mm) .

Capable of large IC device production .

New bonding head, rigid and lightweight satisfies high accurate bondinperformance and low impact load to boards .

Composite bonding ar1701 lightweight mini-hoHigh speed touch detector .

Capable of alloy wire(Ag/Cu )bonding optionally.

User friendly new operational environment by Windows.

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