1，Sophisticated wire bonder capable of high quality bonding performance 2，New bonding head，rigid and lightweight satisfies high accurate bonding perfomance and low impact load to boards 3，New recognition algorithm 4,Capable of alloy wire(Ag/Cu)bonding optionally
5，User friendly new operational environment by Windows
Features of FB-i28 1，Sophisticated wire bonder capable of high quality bonding performance 2，New bonding head，rigid and lightweight satisfies high accurate bonding perfomance and low impact load to boards 3，New recognition algorithm 4,Capable of alloy wire(Ag/Cu)bonding optionally
5，User friendly new operational environment by Windows
