HANHWA
Ultrasonic hot pressing bonding method
Corresponding to 12 inch (300mm) wafers, without wafer rotation structure
High speed welding action of ceiling mounted XYZ welding platform+wafer transfer structure
Reduce vibration through XY platform without recoil structure
Set up 2 monitors to improve operability and visual recognition
Equipped with multiple temperature sensors, real-time and full-time correction of welding positions
Standard configuration: 128GB SSD.
Software can be read from USB memory and software upgrades are easy to operateAs an external communication I/F, it comes standard with SECS/GEM
Our company's proprietary engineering management system KISS can also be used
